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How to Use This Tool

  • Choose Method: Select from preset microstructures, upload your own image, or draw a custom design.
  • Set Parameters: Adjust the thermal conductivity ratio (κ₁) and direction angle (α) to see how they affect heat transfer.
  • Analyze Results: View heat flux and temperature distribution across your microstructure.
  • Interact: Zoom, pan, and download any visualization for further analysis.
Preset Microstructures
Upload Image
Draw Custom
0.2
Supported formats: PNG, JPEG, GIF. Images will be processed as binary (black/white) microstructures, where white represents the conductive phase.

Draw Custom Microstructure

Drawing Tools

10px

Canvas Operations

Shapes & Patterns

Save & Load

Keyboard Shortcuts

  • W - White tool
  • B - Black tool
  • E - Eraser
  • Ctrl+Z - Undo
  • Ctrl+Y - Redo
  • Esc - Cancel current action

White = conductive phase (κ₁)

Black = base phase (κ₀)

Draw a two-phase structure for best results.

Welcome to the Microstructure Thermal Simulation tool. Select a microstructure source (preset, upload, or draw) and adjust parameters to see results.

NFDI demonstrator by Data Analytics in Engineering

Authors: Julius Herb (herb@mib.uni-stuttgart.de), Sanath Keshav (keshav@mib.uni-stuttgart.de), Felix Fritzen (fritzen@mib.uni-stuttgart.de)

Affiliation: Heisenberg Professorship Data Analytics in Engineering, Institute of Applied Mechanics, University of Stuttgart | Universitätsstr. 32, 70569 Stuttgart | https://www.mib.uni-stuttgart.de/dae

Funding acknowledgment

Contributions by Felix Fritzen are partially funded by Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany's Excellence Strategy - EXC 2075 – 390740016. Felix Fritzen is funded by Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) within the Heisenberg program DFG-FR2702/8 - 406068690 and DFG-FR2702/10 - 517847245.

Contributions of Julius Herb are partially funded by the Ministry of Science, Research and the Arts (MWK) Baden-Württemberg, Germany, within the Artificial Intelligence Software Academy (AISA).

The authors acknowledge the support by the Stuttgart Center for Simulation Science (SimTech).